Recognising the need for emerging applications to build on a strong foundation that supports interoperability among all categories of devices, four sponsor members – The ASSA ABLOY Group which includes HID Global, and NXP Semiconductors, Samsung Electronics, and Bosch, leading companies in access, secure connectivity and mobile/CE device solutions – announced the launch of the FiRa Consortium.
The new coalition is designed to grow the Ultra-Wideband (UWB) ecosystem so new use cases for fine ranging capabilities can thrive, ultimately setting a new standard in seamless user experiences. Sony Imaging Products & Solutions Inc., LitePoint and the Telecommunications Technology Association (TTA) are the first companies to join the newly-formed organisation.
